Tris (dimethylaminomethyl) Phenol Dmp-30 CAS 90-72-2
Tris (dimethylaminomethyl) Phenol Dmp-30 CAS 90-72-2
DMP-30 As a special curing accelerator for epoxy resins and a tri-curing catalyst for polyurethanes, it enables rapid curing at room temperature and is widely applied in various industrial fields such as coatings and adhesives.
Product Details
| Purity % | ≥95 |
| Amine value,mgKOH/g | 610-635 |
| Viscosity @ 25ºC, mPa·S | 120-250 |
| Water,w% | 0.5 Max |
product superiority
1. Efficient Catalysis: The tertiary amine structure provides strong catalytic activity, significantly accelerating the curing reaction of epoxy resins.
2. Low-Temperature Curing: Effective curing can be achieved at temperatures ranging from 5 to 15°C, with excellent winter construction performance.
3. Economical Dosage: The addition amount is only 5-10% of the epoxy resin, with high cost-effectiveness.
4. Good Compatibility: Compatible with various epoxy resins, diluents, and fillers, with a transparent and stable system.
5. Low Volatility: The molecular weight is high (265.4), with low vapor pressure, small odor, and low VOC emissions.
product application
1. Epoxy resin coating
As an efficient curing accelerator, it can accelerate the room-temperature curing process of epoxy anti-corrosion coatings, floor coatings, and marine coatings, significantly enhancing the adhesion, impact resistance, and chemical corrosion resistance of the paint film, and meeting the long-term protection requirements of steel structures and concrete substrates.
2. Epoxy resin adhesive
Used in the formulation of epoxy structural adhesives, encapsulants, and special adhesives, it can quickly cure the adhesive layer at low temperatures or at room temperature, enhancing the bonding strength and toughness, and meeting the high-strength bonding requirements of multiple materials such as metals, ceramics, and composite materials, suitable for applications in electronics, machinery, and construction.
3. Epoxy resin sealant
After being added to the epoxy sealant system, it can optimize the curing rate and crosslink density, improving the anti-aging, weather resistance, and sealing properties of the sealant, and is widely used in building joint sealing, waterproof sealing of electronic components, and sealing of industrial equipment components, etc.
4. Epoxy floor
As the core curing aid of epoxy floor materials, it can shorten the curing time after floor construction, reduce the risks of moisture re-entry and sanding, and the cured floor surface is smooth and flat, with the characteristics of wear resistance, pressure resistance, and easy cleaning, suitable for factory workshops, warehouse logistics centers, parking lots, etc.
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